EXPOSURE METHOD USING DIFFERENT KINDS OF ALIGNMENT EXPOSURE APPARATUS

摘要

PURPOSE: An exposure method using different kinds of alignment exposure apparatus is to decrease the production cost of semiconductor fabrication equipment and effectively use the exposure apparatus. CONSTITUTION: An exposure method using different kinds of alignment exposure apparatus comprises the steps of: providing a substrate; forming an objective layer on the substrate; coating a photoresist film on the objective layer; and defining the photoresist film by using either a stepper type alignment exposure apparatus or a scanner type alignment apparatus depending on the property of the objective layer. The objective layer is an intermetallic dielectric layer including a contact hole. The scanner type alignment exposure apparatus has an exposure characteristic lower than the stepper type alignment exposure apparatus.