发明名称 CONDUCTIVE BALL MOUNTING DEVICE AND MOUNTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a conductive ball mounting device and mounting method with which conductive balls can be mounted on a work in a highly efficient and stable manner. SOLUTION: In this mounting method wherein conductive balls 10 are vacuum-chucked and picked up by the pickup head 8 where a plurality of chuck holes 8b are formed on the lower surface and the balls 10 are mounted on a work, a mask member 12 is attached from the mounting hole 12e provided on the side face of the pickup head 8, and the chuck holds 8b are partially blocked up in accordance with the ball mounting range of the conductive balls using a plate part 12a. Accordingly, the conductive balls 10 are chucked on the chucking part 14 only corresponding to the ball mounting range, and the conductive balls are mounted on the different ball mounting ranges using a single pickup head 8.
申请公布号 JP2000277555(A) 申请公布日期 2000.10.06
申请号 JP19990079119 申请日期 1999.03.24
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKAI TADAHIKO;SAKAMI SEIJI;NODA KAZUHIRO
分类号 H05K3/34;B23K3/06;H01L21/60;H01L23/12;(IPC1-7):H01L21/60 主分类号 H05K3/34
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