Molded resin plate with internal voids and method and system for manufacturing a molded resin plate

摘要

A method of manufacturing a molded resin plate formed with internal voids comprises: forming seed holes by discharging a pressure medium in a resin body injected in a cavity of a die and increasing the size of the resin body, making the seed holes grow and expanding the cavity of the die. An independent claim is also included for a system for manufacturing the molded resin plate (1) with internal voids comprising two molding walls, a cavity, a resin supply mechanism, several nozzles, a medium discharge mechanism, and a drive mechanism. The two molding walls are arranged in opposition to each other. The two molding walls define the cavity. The resin supply mechanism is configured to supply the cavity with a body of resin having a first volume. The nozzles are fitted to at least one of the two molding walls. The medium discharge mechanism is configured to discharge a body of the pressure medium having a second volume under given temperature and pressure, through the nozzles to the cavity. The drive mechanism is configured to move at least one of the two molding walls relative to the other to expand the cavity to a third volume. The third volume is equal to the sum of the first and the second volumes.