Improved top layer imaging lithography for semiconductor processing

摘要

Etching a surface (12) comprises: (a) providing an under layer (14) on a substrate with a top layer (16) on it; (b) patterning the top layer to expose parts of the under layer; (c) forming a siliceous layer (22) on the exposed parts; (d) removing the top layer to expose the under layer in parts other than the parts having the siliceous layer on them; and (e) etching the under layer in parts other than the parts having the siliceous layer on them.