| 摘要 |
PURPOSE: A cavity bar structure for molding a semiconductor is provided to prevent the damage of a lead frame by automatically aligning the position of a lead frame by a guide pin. CONSTITUTION: A cavity bar structure for molding a semiconductor is fixed to chases(3,4) of the molding parts(1,2) of upper and lower parts. A lead frame(7) is positioned on a lower cavity bar main body(6), and the hole of a lead frame(7) is inserted into a position determining pin(8). A guide pin(10) horizontally pushes the lead frame(7). By supporting the lead frame(7) of the guide pin(10), the lead frame(7) is automatically aligned. After the lead frame(7) is seated on a lower cavity bar main body(6), upper and lower part molding parts(1,2) are driven by a driving part manipulation. After coupling the cavity bar main bodies(5,6), a transfer is operated thereby injecting a molding resin into the cavity bar main bodies(5,6). After elapsing a predetermined time, a resin has the same shape as a cavity shape, and thus a molding operation is completed. After completing the molding operation, the upper and lower part molding parts(1,2) are reproduced as an original state, simultaneously with fixing the lead frame(7). Thereby, the damage of a lead frame can be prevented.
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