| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition excellent in moisture resistance reliability, storage stability, ejecting operability and coating operability by making the composition include a solid epoxy resin, liquid phenolic resin, latent curing promoter, etc., and setting the viscosity of the composition to be at specified levels at specific temperatures, respectively. SOLUTION: This composition is obtained by being made to include (A) a solid epoxy resin, pref. polyfunctional solid epoxy resin, (B) a liquid phenolic resin such as allylated phenol novolak, (C) a latent curing promoter, and (D) an inorganic filler, pref. spherical fused silica powder, and setting the viscosity of the composition at >=7,000 p at 25 deg.C and <=5,000 p at 80 deg.C, wherein the component C is pref. a microencapsulated type curing promoter having core/shell structure where a core portion consisting of a curing promoter such as triphenylphosphine is coated with a shell portion consisting mainly of a polymer composed of structural unit of the formula (R is a bivalent or trivalent organic group; R1 and R2 are each H or the like).
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