ADHESIVE TRANSFER APPARATUS WITH TAKE-UP ROLL AND A REMOVABLE CARTRIDGE FOR A MASTER PROCESSING APPARATUS

摘要

The application discloses an adhesive transfer apparatus (10) comprising a frame (12), a first feed roll (168) carrying a supply of an adhesive transfer substrate (170), and a second feed roll (160) carrying a supply of an adhesive mask substrate (166). The adhesive transfer substrate has a layer of pressure-sensitive adhesive disposed on an adhesive carrying side thereof. The first and second feed rolls are rotatably mounted to the frame. The adhesive mask substrate has a bonding side to which the adhesive will bond. The first and second feed rolls are positioned such that the selected substrate can be inserted between the transfer substrate and the mask substrate. A take-up roll (136) is rotatably mounted to the frame. The adhesive mask substrate has a lead end portion thereof connected to the take-up roll. A pressure applying assembly (125) is constructed and arranged to apply pressure to the transfer substrate and the mask substrate with the selected substrate inserted therebetween. The apparatus being constructed and arranged such that, when the selected substrate is inserted between the adhesive transfer substrate and the adhesive mask substrate, an adhesive transfer operation can be performed wherein (a) the transfer substrate (170), the mask substrate (166), and the selected substrate are moved together in a feeding direction (b) the pressure applying assembly (125) applies pressure to the transfer substrate and the mask substrate with the selected substrate inserted therebetween to cause the adhesive on the adhesive carrying side of the adhesive transfer substrate to adhesively bond to one side of the selected substrate and to any portions of the bonding side of the mask substrate which extend adjacent the periphery of the selected substrate and are engaged directly with the adhesive layer, and (c) the take-up roll (136) rotates to wind up a discharged portion of the mask substrate to which the pressure has been applied along with any portions of the adhesive layer bonded to the bonding side of the discharged portion remaining bonded thereto and being substantially removed from the adhesive carrying side of the transfer substrate.