Verfahren und Vorrichtung zum Bestücken von Substraten mit Bauelementen

摘要

At least the parts of the holding device (3) that are facing towards the component (2) are coupled to the placement head (4) by a spring (6), in order to achieve a defined contact pressure of the components (2) on the substrates. Said spring causes the components (2) to accelerate excessively as they are received from supply devices, which can cause said components (2) to fall off. According to the invention and device, the spring coupling is replaced by a rigid coupling as the component (2) is received from the supply device (8). The acceleration that acts on the component (2) is reduced, so that the placement capacity can be improved through higher receiving speeds while maintaining the same degree of acceleration actually acting on the component (2).