发明名称 METHOD AND EQUIPMENT FOR MANUFACTURING BONDED MAGNET
摘要 PROBLEM TO BE SOLVED: To provide a method and equipment for manufacturing a bonded magnet, capable of smoothly filling the forming space of a forming die with a kneaded material of magnetic powder and a liquid binder resin, free from dispersion of the amount of filling, and capable of providing a bonded magnet having excellent dimensional accuracy. SOLUTION: The forming die is provided with dies 12, 14 having a filling-side punch 20 and a pressing-side punch 36, respectively. The filling-side die 12 is filled with a kneaded material of magnetic powder and a liquid binder resin, and the kneaded material is compressed using the pressing-side punch 36 to form a bonded magnet. The filling-side punch 20 of the die is excitably provided by being wound with an exciting coil 30 and also is slidably provided with respect to a die 18 of the die and can form a forming space. When the die is filled with the kneaded material, the filling-side punch 20 is excited and the kneaded material is magnetically attracted to the filling-side punch 20.
申请公布号 JP2001003105(A) 申请公布日期 2001.01.09
申请号 JP19990173547 申请日期 1999.06.21
申请人 SANKYO SEIKI MFG CO LTD 发明人 HOSHINA TETSUO
分类号 B22F3/02;H01F41/02;(IPC1-7):B22F3/087 主分类号 B22F3/02
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