发明名称 MANUFACTURE OF LIGHT MODULATION DEVICE
摘要 PROBLEM TO BE SOLVED: To improve an SN ratio by increasing a change in curvature of reflecting interface and improving a light-condensing performance, also to realize miniaturization and space saving, and to improve a production efficiency. SOLUTION: By this production method, the wiring connecting between a piezo-electric element 30 and a driving element 50 can be formed relatively easier by comprising a process for forming a driving element 50 on a substrate 11, a process for forming an insulating film 12 on the driving element 50, a process for forming a connection terminal part for connecting to the driving element 50 on the insulating film 12, a process for leading out of the connection terminal part a drive wiring 53 to be connected with either of the electrodes of the piezo-electric element 30, a process for pattern-forming a sacrificing layer 70 for forming the piezo-electric element 30 via a supporting member at a position corresponding to the driving element 50, a process for pattern- forming the piezo-electric element 30 on the sacrificing layer 70, a process for forming a 1st connection wiring 36 for connecting either of the electrodes of the piezo-electric element 30 with the drive wiring 53 and also forming a 2nd connection wiring 37 to be connected with the other electrode, and a process for forming the supporting member by removing the sacrificing layer 70.
申请公布号 JP2001013426(A) 申请公布日期 2001.01.19
申请号 JP19990182464 申请日期 1999.06.28
申请人 SEIKO EPSON CORP 发明人 SHIMADA KATSUTO;SAKAI MARI
分类号 H04N5/74;G02B26/08;H01L41/09;(IPC1-7):G02B26/08 主分类号 H04N5/74
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