发明名称 |
Electronic component used as an OFW/SAW component has a substrate plate covered with a tin dioxide layer, and an electrical conductor structure |
摘要 |
Electronic component (1) has a substrate plate (10) and an electrical conductor structure (12, 13). The substrate plate is covered with a tin dioxide layer (16) as passivating layer in the region to be passivated over the conductor structure. An Independent claim is also included for a process for the production of a tin dioxide layer on a surface of a substrate plate over conductor structures comprising photolytic oxidation of a tin IV compound to form tin dioxide.
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申请公布号 |
DE19933548(A1) |
申请公布日期 |
2001.01.25 |
申请号 |
DE1999133548 |
申请日期 |
1999.07.16 |
申请人 |
EPCOS AG |
发明人 |
ROTTMANN, MATTHIAS;PAHL, WOLFGANG |
分类号 |
H01L23/00;H03H9/02;(IPC1-7):H01L23/29;H01L21/56;H03H9/25;H01L23/52 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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