发明名称 Electronic component used as an OFW/SAW component has a substrate plate covered with a tin dioxide layer, and an electrical conductor structure
摘要 Electronic component (1) has a substrate plate (10) and an electrical conductor structure (12, 13). The substrate plate is covered with a tin dioxide layer (16) as passivating layer in the region to be passivated over the conductor structure. An Independent claim is also included for a process for the production of a tin dioxide layer on a surface of a substrate plate over conductor structures comprising photolytic oxidation of a tin IV compound to form tin dioxide.
申请公布号 DE19933548(A1) 申请公布日期 2001.01.25
申请号 DE1999133548 申请日期 1999.07.16
申请人 EPCOS AG 发明人 ROTTMANN, MATTHIAS;PAHL, WOLFGANG
分类号 H01L23/00;H03H9/02;(IPC1-7):H01L23/29;H01L21/56;H03H9/25;H01L23/52 主分类号 H01L23/00
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