| 摘要 |
PROBLEM TO BE SOLVED: To provide a light weight, excellent temperature rising and falling characteristics, no warp even when a probe card is pressed and to effectively prevent a damage or a measuring miss of a silicon wafer by providing a conductor layer at ceramics having high rigidity as a chuck top conductor layer. SOLUTION: In the wafer prober 10, concentrically circular grooves 1 are formed on a surface of a ceramic board 3 in a circular shape as seen in plane, a plurality of suction holes 8 for sucking a silicon wafer are provided partly in the grooves 7, and a chuck top conductor layer 2 for connecting electrodes of the wafer to most portion of the board 3 including the grooves 1 is formed in a circular shape. A heater 41 of concentrically circular shape as seen in plane is provided to control a temperature of the wafer in a bottom of the board 3, external terminal pins are fixedly connected to both ends of the heater 41. Further, guard electrodes 5 and ground electrodes 6 for removing a stress capacitor or a noise are provided in the board 3.
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