发明名称 PHOTOSENSITIVE POLYIMIDE PRECURSOR WITH EASY THICK FILM PROCESS
摘要 PURPOSE: Provided is a composition of photosensitive polyimide precursor which maintains low viscosity even with 20-45wt.% of the solid content making it easy to obtain thick film of not less than 10 micrometer thickness. The membrane made of the precursor has excellent permeation of UV light and has high resolution. CONSTITUTION: The preparation method comprises: making the polyimide precursor of the formula 1 which has 1-50mol.% excess mole equivalence of dihydrate to diamine containing 1-10mol.% of the formula 4; esterifying the above polyimide precursor with alcohol to obtain polyimide precursor represented by formula 2; making the polyimide precursor of the formula 3 which has 1-50mol.% excess mole equivalence to dihydrate; and mixing the polyimide precursor of formula 2 and 3. In the above formula, R1 and R2 is cyclic aromatic group and R3 is saturated or unsaturated aliphatic group. The composition consists of the polyimide precursor, photosensitive chemicals and photo-polymerization initiator. The composition is used as a buffer coating membrane in the semiconductor device.
申请公布号 KR100288845(B1) 申请公布日期 2001.02.12
申请号 KR19980003094 申请日期 1998.02.04
申请人 CHEIL INDUSTRIES INC. 发明人 CHOI, JIN SEONG;JUNG, MYEONG SEOP;KIM, DO YUN;MUN, BONG SEOK;NOH, CHANG HO;PARK, JAE GEUN
分类号 G03C1/72;(IPC1-7):G03C1/72 主分类号 G03C1/72
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