摘要 |
PROBLEM TO BE SOLVED: To surely and easily connect a plurality of wire materials to pin sockets of a board inspection apparatus. SOLUTION: In this inspection apparatus, contact probes 3 are inserted and attached to ends, on one side, of pin sockets 2 which are arranged at an acrylic board 1 in a through state. A plurality of through holes 5 are formed, along the lingitudinal direction of the pin sockets 2, on sides, on the other side, of the pin sockets 2. Core wires 4a of a plurality of wire materials 4 are soldered and connected after they are passed through the through holes 5 one by one. As a result, the core wires 4a can be connected easily and surely one by one.
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