发明名称 BOARD INSPECTION APPARATUS
摘要 PROBLEM TO BE SOLVED: To surely and easily connect a plurality of wire materials to pin sockets of a board inspection apparatus. SOLUTION: In this inspection apparatus, contact probes 3 are inserted and attached to ends, on one side, of pin sockets 2 which are arranged at an acrylic board 1 in a through state. A plurality of through holes 5 are formed, along the lingitudinal direction of the pin sockets 2, on sides, on the other side, of the pin sockets 2. Core wires 4a of a plurality of wire materials 4 are soldered and connected after they are passed through the through holes 5 one by one. As a result, the core wires 4a can be connected easily and surely one by one.
申请公布号 JP2001041974(A) 申请公布日期 2001.02.16
申请号 JP19990213127 申请日期 1999.07.28
申请人 FUJI PHOTO FILM CO LTD 发明人 IZUKI TAKASHI
分类号 G01R31/28;G01R1/06;G01R31/02;H05K3/00;(IPC1-7):G01R1/06 主分类号 G01R31/28
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