| 摘要 |
There is disclosed a plastic mold type semiconductor device comprising: a semiconductor chip, leads each having one end portion positioned outside the semiconductor chip in a manner spaced therefrom and the other end portion extending to the portion above the semiconductor chip, and bonding wires for connecting the semiconductor element and the leads, each of the leads being provided with a bonding portion positioned outside of the semiconductor chip. Even if the size of the semiconductor chip and that of the envelope are extremely close to each other, the lead has sufficient length within the molded plastic material so that the lead may not be pulled out.
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