发明名称 CIRCUIT BOARD USING CONDUCTIVE INK AND SEMICONDUCTOR PACKAGE USING THE SAME
摘要 PURPOSE: A circuit board using conductive ink is provided to prevent an error in treating a printed circuit board and to eliminate damage to an electrical connection inside a package, by making conductive ink have strong resistibility regarding stress even if the printed circuit board is warped or twisted by external force. CONSTITUTION: A plurality of conductive ink layers(12,13) are installed on a resin substrate(11), and have a bond finger part in an inside end portion of the substrate as a circuit pattern. A plurality of solder ball lands(15) are electrically connected to the respective conductive ink layers, and are installed on a lower surface of the resin substrate. The substrate is either one of a printed circuit board or film.
申请公布号 KR20010018381(A) 申请公布日期 2001.03.05
申请号 KR19990034330 申请日期 1999.08.19
申请人 AMKOR TECHNOLOGY KOREA, INC. 发明人 RYU, SANG HYEON
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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