Production of semiconductor wafers comprises simultaneously polishing front and rear sides of each wafer between polishing plates covered with cloth, evaluating and then re-polishing

摘要

Production of a number of semiconductor wafers comprises simultaneously polishing the front and rear sides of each wafer between polishing plates covered with a cloth and with the introduction of a polishing agent; polishing the front side of each wafer on a polishing plate; evaluating each wafer; re-polishing the front side of each wafer; and re-evaluating the each wafer with respect to the quality and returning to re-polishing step. Preferred Features: The material removed from each wafer in the first step is 3-170 microns m. The polishing agent contains 0.5-10 wt.% and has a pH of 9-12.