| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-thickness measuring apparatus by which a film thickness can be measured with high accuracy. SOLUTION: The film thickness measuring apparatus is provided with a two-branch optical fiber 16 and a lens 13 by which a wafer W is irradiated with light from a light source 14, a spectroscope 20 which measures a reflected- light intensity distribution on the basis of reflected light from the wafer W, and a film-thickness calculation part 23 which finds a relative reflected-light intensity distribution as the ratio of a measured reflected-light intensity distribution to a reference reflected-light intensity distribution obtained on the basis of reflected light from a work as a wafer W before a film is laminated and which calculates the film thickness of a film, in such as way that a theoretical reflected-light intensity distribution derived from a transmitted light theory is compared with the relative reflected-light intensity distribution.
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