| 发明名称 |
Method for copper plating deposition |
| 摘要 |
<p>The present invention describes a method for copper deposition on a substrate having a barrier layer wherein a substrate (2) and an activator (1) are immersed in a copper plating bath in order to contact each other for a predetermined period. <IMAGE></p> |
| 申请公布号 |
EP1103633(A1) |
申请公布日期 |
2001.05.30 |
| 申请号 |
EP20000870283 |
申请日期 |
2000.11.28 |
| 申请人 |
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW |
发明人 |
PALMANS, ROGER;LANTASOV, YURI |
| 分类号 |
C23C18/54;H01L21/288;H01L23/532;H05K3/24;(IPC1-7):C23C18/54 |
主分类号 |
C23C18/54 |
| 代理机构 |
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