发明名称 |
Photosensitive resin composition, porous resin, circuit board, and wireless suspension board |
摘要 |
<p>The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics. <IMAGE></p> |
申请公布号 |
EP1103855(A1) |
申请公布日期 |
2001.05.30 |
申请号 |
EP20000125812 |
申请日期 |
2000.11.24 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MOCHIZUKI, AMANE;FUKUOKA, TAKAHIRO;KANADA, MITSUHIRO;YAMAMOTO, TAKAYUKI;TARUNO, TOMOHIRO |
分类号 |
G03F7/004;G03F7/037;H05K1/00;H05K1/02;H05K1/03;H05K1/05;H05K3/00;H05K3/28;(IPC1-7):G03F7/037 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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