发明名称 |
WORKING DEVICE FOR OUTER PERIPHERAL PART OF WAFER |
摘要 |
PROBLEM TO BE SOLVED: To attain relaxation in centering accuracy, improve working accuracy of an outer peripheral part and shorten working time or the like concerning a contouring type outer wafer peripheral part working device. SOLUTION: For this working device for outer peripheral part of a wafer, the contouring type outer wafer peripheral part working device is provided with a pressing means for relatively pressing a working tool to a wafer at a prescribed pressure.
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申请公布号 |
JP2001160542(A) |
申请公布日期 |
2001.06.12 |
申请号 |
JP19990341181 |
申请日期 |
1999.11.30 |
申请人 |
SHIN ETSU HANDOTAI CO LTD |
发明人 |
MIZUSHIMA KAZUHISA;YAMADA MASAYUKI |
分类号 |
B24B9/00;H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
B24B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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