发明名称 WORKING DEVICE FOR OUTER PERIPHERAL PART OF WAFER
摘要 PROBLEM TO BE SOLVED: To attain relaxation in centering accuracy, improve working accuracy of an outer peripheral part and shorten working time or the like concerning a contouring type outer wafer peripheral part working device. SOLUTION: For this working device for outer peripheral part of a wafer, the contouring type outer wafer peripheral part working device is provided with a pressing means for relatively pressing a working tool to a wafer at a prescribed pressure.
申请公布号 JP2001160542(A) 申请公布日期 2001.06.12
申请号 JP19990341181 申请日期 1999.11.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 MIZUSHIMA KAZUHISA;YAMADA MASAYUKI
分类号 B24B9/00;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B9/00
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