发明名称 |
CIRCUIT CONNECTING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide an electric and electronic circuit connecting material for connecting the circuit electrically at low temperatures in a short time using an ultrasonic wave. SOLUTION: In a connecting method, a first circuit member with a first connection terminal and a second circuit member with a second connection terminal are so arrange that the first connection terminal and the second connection terminal are put opposite and overlapped with the circuit material in between. In this state, the first connection terminal and the second connection terminals are connected electrically using ultrasonic wave. The connecting material contains essentially an adhesive to be hardened by heating or radiation energy and an insulating micro-particle with an area/weight ratio of 0.1 to 500 m2/g.
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申请公布号 |
JP2001160671(A) |
申请公布日期 |
2001.06.12 |
申请号 |
JP19990343179 |
申请日期 |
1999.12.02 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
FUJINAWA MITSUGI;YUSA MASAMI;ONO YUTAKA;TAI SEIJI |
分类号 |
H05K1/14;C09J9/00;C09J201/00;G02F1/1345;H01B1/20;H01L21/60;(IPC1-7):H05K1/14;G02F1/134 |
主分类号 |
H05K1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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