发明名称 CIRCUIT CONNECTING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide an electric and electronic circuit connecting material for connecting the circuit electrically at low temperatures in a short time using an ultrasonic wave. SOLUTION: In a connecting method, a first circuit member with a first connection terminal and a second circuit member with a second connection terminal are so arrange that the first connection terminal and the second connection terminal are put opposite and overlapped with the circuit material in between. In this state, the first connection terminal and the second connection terminals are connected electrically using ultrasonic wave. The connecting material contains essentially an adhesive to be hardened by heating or radiation energy and an insulating micro-particle with an area/weight ratio of 0.1 to 500 m2/g.
申请公布号 JP2001160671(A) 申请公布日期 2001.06.12
申请号 JP19990343179 申请日期 1999.12.02
申请人 HITACHI CHEM CO LTD 发明人 FUJINAWA MITSUGI;YUSA MASAMI;ONO YUTAKA;TAI SEIJI
分类号 H05K1/14;C09J9/00;C09J201/00;G02F1/1345;H01B1/20;H01L21/60;(IPC1-7):H05K1/14;G02F1/134 主分类号 H05K1/14
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