| 摘要 |
PURPOSE: To completely prevent defective dies from being picked up from a wafer and packed in a tray or to minimize the number of defective dies picked up from the wafer and packed in the tray, and to eliminate the need for packing defective dies to more than required in the tray, and to use the defective dies without loss. CONSTITUTION: Dies 2 on a wafer 1 are sequentially detected with a camera 52 and are classified into satisfactory and defective ones, based on the detection results and are registered on a wafer/fall map. When dies are required from the boding side of a tape 20, dies are picked up and carried by a die-carrying nozzle 50, according to the detection results registered on the wafer pass/fail map and are bonded. |
