| 摘要 |
A sampling device for thermal analysis of solidifying metal is disclosed. The sampling device comprises at least a first cavity and a second cavity, the first and second cavities adapted to be filled with a molten metal to be analysed and each cavity adapted to comprise a temperature responsive means during thermal analysis. The inlet opening of the common filling inlet is arranged in a second plane essentially parallel to a first horizontal plane tangent to an uppermost portion of the sampling device and located below said first plane. |
