| 发明名称 |
Package Structure and Three Dimensional Package Structure |
| 摘要 |
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole. |
| 申请公布号 |
US2016343653(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201514860723 |
申请日期 |
2015.09.22 |
| 申请人 |
WIN Semiconductors Corp. |
发明人 |
Huang Chih-Wen;Chiu Jui-Chieh;Huang Fan-Hsiu |
| 分类号 |
H01L23/498;H01L23/31;H01L25/065 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure, comprising:
at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, wherein at least a first hole, or a material capable of electrically conducting at least a lead frame of the package structure, is formed within the at least a routing layer; a die, disposed on the at least a routing layer, wherein at least a second hole is formed within the die, the die generates or receives the at least a signal, and the at least a signal is delivered between a first side and a second side of the die through the at least a second hole; and a molding cap, for covering the at least a routing layer and the die; wherein the at least a signal is delivered between the die and the at least a lead through the at least a first hole and the at least a second hole, or through the at least a lead frame. |
| 地址 |
Tao Yuan City TW |
