GLASS CLAD MICROELECTRONIC SUBSTRATE

摘要

Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.

主权项

1. A microelectronic substrate, comprising:
a first glass layer; at least one first through-glass contact structure extending through the first glass layer; a trace routing structure on the first glass layer, wherein the trace routing structure comprises at least one dielectric layer and at least one conductive traces on and through the at least one dielectric layer, and wherein the at least one conductive trace electrically contacts at least one first through-glass contact structure; a second glass layer may be attached to the trace routing structure opposing the first glass layer; and at least one second through-glass contact structure, wherein at least one conductive trace within the trace routing structure electrically contacts the at least one second through-glass contact structure; wherein the first glass layer and the second glass layer are formed of a material which differs from the at least one dielectric layer of the trace routing structure.