| 摘要 |
PROBLEM TO BE SOLVED: To provide an acidic palladium electroplating solution with which plating is carried out hardly causing hydrogen coprecipitation as a pending problem. SOLUTION: This palladium electroplating solution contains at least 1-60 g/l soluble palladium slat, expressed in terms of palladium, 0.1-300 g/l complexing agent and 1-300 g/l carboxylic buffer, and the solution is kept at pH 1-7.
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