CLEANING METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A cleaning method for manufacturing a semiconductor device is provided to optimize cleaning of a wafer and to minimize a process defect caused by particles, by spraying gas through a groove installed between slots of a hood while the wafer stands by inside the hood. CONSTITUTION: Process gas is sprayed through a groove(50) formed between slots(40) of a hood(30) to prevent influence by the increase of cleaning liquid while a wafer stands by in the hood, so that portions(35,37) above and under the wafer in the hood are filled with the process gas. Mixture gas is sprayed at a position above the hood in a dry process in which the wafer is transferred from a process bath to the hood.