| 摘要 |
PURPOSE: A structure and a method for firmly attaching a molding compound to a lead frame paddle are provided to improve adhesive strength between the molding compound and a top surface of the lead frame paddle in an exposed paddle-based mold package. CONSTITUTION: In the structure, half-holes(104) are provided by etch on the top surface of the lead frame paddle(102). Further, an anchor(114) is provided at each side surface of the lead frame paddle(102). A semiconductor die(110) is attached on the top surface of the lead frame paddle(102). During a molding process, the molding compound(118) covers the die(110) and the anchors(114) and fills the half-holes(104). The half-holes(104) helps to firmly attach the molding compound(118) to the lead frame paddle(102) by increasing surface area between the molding compound(118) and the top surface of the lead frame paddle(102). In addition, the molding compound(118) encapsulates the anchors(114). Therefore, when the molding compound(118) is cured, the molding compound(118) is strengthened and supported by the anchors(114) obstructing vertical movements of the molding compound(118). |
