发明名称 |
Apparatus for polishing leads of a semiconductor package |
摘要 |
An apparatus for polishing leads of a semiconductor package includes a package holder unit on which a plurality of semiconductor packages are arranged; and a polishing member that automatically polished the leads of the semiconductor package on the package holder unit. A mask may be used to cover the plurality of semiconductor packages to expose at least a part of the leads to the polishing member.
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申请公布号 |
US6336848(B1) |
申请公布日期 |
2002.01.08 |
申请号 |
US19980120134 |
申请日期 |
1998.07.22 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
SATO TAKEYUKI |
分类号 |
B24B29/00;B24B29/02;H01L21/48;H01L23/50;(IPC1-7):H01L21/00 |
主分类号 |
B24B29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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