| 摘要 |
PROBLEM TO BE SOLVED: To maintain adhesion of a conductor layer for fine wiring pattern, while lowering the formation cost of a connection with other board and improving the quality of the connection.SOLUTION: A wiring method of a printed wiring board has preparation of a support plate provided with a metal film on at least one surface thereof, formation of a conductor layer 21 having a predetermined pattern on the metal film, formation of a conductor post 25 on the conductor layer 21, formation of an uncured resin layer on the surface of the metal layer where the conductor layer 21 is not formed, and on the formation surface of the conductor layer 21, formation of an opening penetrating the resin layer and exposing a part of the conductor layer 21, formation of a resin insulation layer 30 by curing the resin layer, formation of a conductor post 25 in the opening, separation of the support plate and metal film, and removal of the metal film.SELECTED DRAWING: Figure 1H |
