| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape-like substrate for mounting electronic parts which can realize a right heating profile by suppressing heat conduction through the substrate and a method of manufacturing mounting substrate. SOLUTION: In the tape-like substrate 6 on which individual piece substrate sections on which electronic parts Pa, Pb and Pc are mounted are continuously formed in the lengthwise direction, heat insulating notches 21 which suppress the heat conduction between the substrate sections 6b are provided in the connecting section between the substrate sections 6b. Consequently, a right temperature profile can be realized at the time of performing reflow after the parts Pa, Pb and Pc are mounted by reducing the heat conduction between the heating zones of a reflow furnace through the substrate 6.
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