发明名称 HIGH-TEMPERATURE SUPERCONDUCTING DEVICE
摘要 PROBLEM TO BE SOLVED: To improve reliability of a high-temperature superconducting device so that no connection peels off in a room temperature or in a low-temperature environment, and no degradation in soldering strength at an electrode occurs when a high-temperature superconducting film is connected to the electrode, related to the high-temperature superconducting device. SOLUTION: In the interface between a high-temperature superconducting film 12A and an electrode 13, a titanium compound 20 is inserted such as a valium titanate, for example, generated through heating reaction with a titanium constituting a part of the electrode 13 and the component material of the high- temperature superconducting film 12A.
申请公布号 JP2002026408(A) 申请公布日期 2002.01.25
申请号 JP20000210765 申请日期 2000.07.12
申请人 FUJITSU LTD 发明人 NAKANISHI TERU;AKASEGAWA AKIHIKO;YAMANAKA KAZUNORI
分类号 H01L39/24;H01L39/02;(IPC1-7):H01L39/24 主分类号 H01L39/24
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