| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component cooling apparatus which can effectively cool a heat generating electronic component like an LSI chip and is smaller than the conventional equipment. SOLUTION: This electronic component cooling apparatus is provided with a ventilating hole 12 facing a temperature boundary layer above a heat dissipating surface 2 of an electronic component, a pressure chamber 18 interconnected with the ventilating hole 12, and a pressure changing means 17 for changing a pressure in the pressure chamber 18.
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