发明名称 |
Multi-zone conditioner for chemical mechanical polishing system |
摘要 |
An apparatus and method for conditioning the polishing pad of CMP system by employing a multi-zone conditioner, or dresser. The conditioner comprises a plurality of rollers or disks, which can be well tuned to make down-pressure and rolling speed of the rollers or disks to the extent as desirable. The conditioner further comprises driving means for rotating the polishing rollers or disks. It can make a better uniformity of the pad conditioning and improve the profile of the polished wafers. The apparatus and method for conditioning the polishing pad can be especially used to compensate the uniformity of the incoming films, or the pre-CMP films.
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申请公布号 |
US6343977(B1) |
申请公布日期 |
2002.02.05 |
申请号 |
US20000525005 |
申请日期 |
2000.03.14 |
申请人 |
WORLDWIDE SEMICONDUCTOR MANUFACTURING CORP. |
发明人 |
PENG SHUANG-NENG;LIN BIH-TIAO |
分类号 |
B24B37/04;B24B53/02;B24B53/14;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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