POROUS FILM FOR PREPREG AND PREPREG FOR CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To obtain both a porous film for a prepreg capable of excellently being subjected to a laser via processing of fine pitch and suitably being impregnated with a thermosetting resin and a prepreg for a circuit board using the same. SOLUTION: This porous film for a prepreg comprises an open cell porous film of a polyamide-based resin. This prepreg for a circuit board comprises a semicured material of a thermosetting resin impregnated into the pores of the porous film.