| 摘要 |
PROBLEM TO BE SOLVED: To make a manufacturing cost inexpensive by lessening the constituent parts of the heat sink of electronic component and simplifying the structure. SOLUTION: In a heat sink, a plurality of heat dissipating fins 4b (5b) are integrally formed on a plane 4a (5a) at a prescribed interval, a pair of heat sink assembling half bodies 4 (5) forming a fitting groove 4c (5c) fitting and fixing the edge part of the heat dissipating fin 5b (4b) formed on the assembling half body of the other heat sink are prepared between the heat dissipating fins 4b (5b), and the edge part of the heat dissipating fin 5b formed on the assembling half body of the other heat sink is fitted to and fixed on the fitting groove 4c formed on the assembling half body of one heat sink.
|
