| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of setting between a focusing surface and an exposure surface when a circuit pattern is subjected to exposure transfer to a wafer. SOLUTION: A wafer is relatively scanned previously by using a plurality of beams for obtaining height information of a wafer before exposure, a step S11 for measuring the height of each part of an object surface is repeated a plurality of times and sensor selection treatment 50 for selecting a sensor for obtaining height information from generation state of data output by a plurality of sensors corresponding to a plurality of measurement beams respectively is executed. When a wafer is subjected to exposure in a step S22, a focusing reference surface is prepared from an output signal of a selected sensor and position control of a wafer is carried out based on the focusing reference surface for exposure.
|
