| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation device or a system to dissipate heat generated by a payload in a spacecraft having a number of surfaces. SOLUTION: The system having one or more cooler-condenser is connected to the surface of a spacecraft having one or more surfaces. A heat pump containing an evaporator, a compressor, and an expansion valve is connected to a cooler-condenser through a closed ring system. System parts are interconnected through piping, having a small caliber and thin thickness, on a smooth wall surface. The system enables the increase of the temperature of the cooler-condenser to a value higher than that of a heat source or a loaded matter, and reduction of the weight of the spacecraft by using together thin- walled piping. This is because the temperature of the cooler-condenser is increased and the many surfaces (west, east, a global surface, a stern surface) of the spacecraft can be highly-efficiently used as a radiating surface.
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