| 摘要 |
A method for manufacturing multi-kind and small-quantity semiconductor products in a mass-production line and a system thereof are provided. One aspect of the present invention, there is provided the method for manufacturing a semiconductor device through a plurality of fabrication processing steps, each of the fabrication processing steps being carried out sequentially with a plurality of chips on a wafer based on a chip identification information formed on the wafer, the method comprises at least two steps sharing the chip identification information before at least one of the two steps is carried out, wherein the steps are not immediately neighbored with each other in fabrication processing sequence.
|
