A process for nitriding an aluminum-containing substrate

摘要

While a nitride film is formed on a substrate containing metallic aluminum, a fluctuation in forming nitride film can be prevented, or the formation of the nitride film can be accelerated. A substrate containing at least metallic aluminum is subjected to a heating treatment in vacuum of 10<-3> torr or less, and subsequently it is subjected to a heating/nitriding treatment in an atmosphere containing at least nitrogen to form a nitride film. A porous body through which a nitrogen atoms-containing gas can flow is clarified by heating at a temperature of 1000 DEG C or more under a pressure of 10<-4> torr or less, and then the porous body is contacted the atmosphere during the heating/nitriding step.