| 摘要 |
PURPOSE: A sputtering apparatus is provided to prevent a sputtering target from being damaged by sensing a temperature of a cathode backing plate in advance. CONSTITUTION: The sputtering apparatus comprises a sputtering target(16) which is formed of a material to be sputtered; a first electrode which is adhered onto one surface of the sputtering target; a chuck(12) which is spaced apart from an opposite surface of the first electrode adhered sputtering target in a certain distance, and which fixes a wafer(14); a chamber(10) which is equipped with a temperature sensing sensor mounted on the first electrode so as to sense a temperature of the sputtering target; and a cooling water inlet and outlet unit for flowing cooling water, the cooling water inlet and outlet unit is mounted on the first electrode of the outer part of the chamber so as to drop a temperature of the first electrode, wherein the temperature sensing sensor is a thermocouple(20), and warning signals are generated when a temperature sensed by the temperature sensing sensor is increased to a certain temperature or more.
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