发明名称 |
Isolation technique for pressure sensing structure |
摘要 |
A pressure sensor in accordance with the invention comprises a die having pressure-sensing electrical components formed in a first side of the die. In one embodiment, a method of securing a cap to a silicon die is provided comprising forming a thin glass particle layer on a bonding area of the cap, heating the cap and the thin glass particle layer on the bonding area to form a substantially continuous glass layer on the bonding area, and heating the cap and silicon die to a temperature above the melting point of the glass to form a bond between the cap and the silicon die.
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申请公布号 |
US2002029639(A1) |
申请公布日期 |
2002.03.14 |
申请号 |
US20010908463 |
申请日期 |
2001.07.18 |
申请人 |
MEASUREMENT SPECIALITIES, INC. |
发明人 |
WAGNER DAVID E.;LOPOPOLO GERALD;HOFFMAN JAMES H. |
分类号 |
G01L7/08;G01L9/00;(IPC1-7):G01L7/00 |
主分类号 |
G01L7/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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