发明名称 |
LOW-TEMPERATURE CURING LATENT CURABLE AGENT FOR EPOXY RESIN |
摘要 |
PROBLEM TO BE SOLVED: To obtain a low-temperature curing latent curable agent for an epoxy resin, having high storage stability (latent ability) and low-temperature curability. SOLUTION: This low-temperature curing latent curable agent for an epoxy resin is characterized by comprising an epoxy resin adduct (C) of a compound A of the formula (R1 is a 2-18C straight-chain or branched-chain alkyl group; R2, R3, R4 and R5 are each the same or different and hydrogen, a 1-17C straight- chain or branched-chain alkyl group or aromatic group; n is an integer of 1-4; m is an integer of 1-4) to an epoxy resin (B) containing at least two epoxy groups.
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申请公布号 |
JP2002088137(A) |
申请公布日期 |
2002.03.27 |
申请号 |
JP20000279468 |
申请日期 |
2000.09.14 |
申请人 |
SANWA CHEMICAL INDUSTRY CO LTD |
发明人 |
TSUCHIYA YOSHIHIRO;TOMARIYA KEISUKE;SHIRAISHI KATSUTOSHI |
分类号 |
C07D233/60;C08G59/14;C08G59/50;(IPC1-7):C08G59/50 |
主分类号 |
C07D233/60 |
代理机构 |
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