发明名称 LOW-TEMPERATURE CURING LATENT CURABLE AGENT FOR EPOXY RESIN
摘要 PROBLEM TO BE SOLVED: To obtain a low-temperature curing latent curable agent for an epoxy resin, having high storage stability (latent ability) and low-temperature curability. SOLUTION: This low-temperature curing latent curable agent for an epoxy resin is characterized by comprising an epoxy resin adduct (C) of a compound A of the formula (R1 is a 2-18C straight-chain or branched-chain alkyl group; R2, R3, R4 and R5 are each the same or different and hydrogen, a 1-17C straight- chain or branched-chain alkyl group or aromatic group; n is an integer of 1-4; m is an integer of 1-4) to an epoxy resin (B) containing at least two epoxy groups.
申请公布号 JP2002088137(A) 申请公布日期 2002.03.27
申请号 JP20000279468 申请日期 2000.09.14
申请人 SANWA CHEMICAL INDUSTRY CO LTD 发明人 TSUCHIYA YOSHIHIRO;TOMARIYA KEISUKE;SHIRAISHI KATSUTOSHI
分类号 C07D233/60;C08G59/14;C08G59/50;(IPC1-7):C08G59/50 主分类号 C07D233/60
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