EPOXY RESIN MOLDING MATERIAL FOR SEALING

摘要

An epoxy resin molding material for sealing which comprises as essential components (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent or (D) a phosphoric acid ester; and a semiconductor device sealed with the material. The material for sealing is excellent in fluidity and can be used for manufacturing a semiconductor device which is thin, has a great number of pins, has a long wire, has a narrow pad pitch, or has semiconductor chips directly arranged on the surface of a substrate; and the semiconductor device sealed with the material, which is thin, has a great number of pins, has a long wire, has a narrow pad pitch, or has semiconductor chips directly arranged on the surface of a substrate, is reduced in the occurrence of a failure in shaping such as the sweep of a wire or the generation of a void.