发明名称 HEAT RADIATION STRUCTURE FOR ELECTRIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide the heat radiation structure of an electric component capable of improving the heat radiation effect of the generated heat of the electric component such as a diode, suppressing the heat radiation of the electric component such as the diode, making just the addition of a heat radiation plate sufficient, suppressing the number of components to the absolute minimum number, simplifying the structure and lowering costs. SOLUTION: The electric component in a cylindrical shape such as the diode 3 is horizontally attached through a leg 4 on a substrate 1, and an engaging hole 2 is formed at a position below the electric component 3 on the substrate 1. The heat radiation plate 7 is provided with a main body 5 whose cross section is arcuate capable of wrapping the electric component 3, and locking pawls 6 extended at both lower ends of the main body 5 to be engaged and locked to the engaging hole 2. The plate 7 is put on the electric component 3 so as to wrap the electric component 3 with the main body 5, and is attached to the substrate 1 by engaging and locking the locking pawls 6 to the engaging hole 2 of the substrate 1. The generated heat from the electric component 3 is radiated by the heat radiation plate 7.
申请公布号 JP2002093972(A) 申请公布日期 2002.03.29
申请号 JP20000284023 申请日期 2000.09.19
申请人 FUNAI ELECTRIC CO LTD 发明人 NAKAO NOBORU
分类号 H05K7/20;H01L23/40;(IPC1-7):H01L23/40 主分类号 H05K7/20
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