| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of oxide films that are generated on the surfaces of solder-coated lead wires, of solder film layers that melt and peel and of deterioration of the solder wettability of the lead wires, when a solid electrolytic capacitor as a capacitor finished product is mounted on a printed-wiring board or the like, when a process in which a solid electrolyte layer is formed inside a capacitor element contains a subprocess in which the temperature of the capacitor element is raised to about 200 deg.C or higher in a manufacturing process for the solid electrolytic capacitor, and where the solid electrolyte layer is formed inside the capacitor element in which an anode foil and a counter cathode foil with formed dielectric films are wound via a separator and in which the solder-coated lead wires are derived from the anode foil and the cathode foil; and the capacitor element is housed inside an outer covering, so as to be sealed up and the lead wires are derived to the outside of the outer covering. SOLUTION: After the process in which the temperature of the capacitor element is raised, polishing treatment is executed, to the surfaces of the lead wires or a solder coating treatment is executed.
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