| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board capable of equally leveling all the plated conductors 6 even though it is a large printed board. SOLUTION: A board 1 is flattened by passing it through between a pair of rollers 11A and 11B. The rollers 11A and 11B with their rotational shafts 12A and 12B stabilized to the respective shaft bush member are held in mutually parallel with axial direction. The cylindrical shape of the rollers 11A and 11B requires only control of parallelism of axial direction of the 12A and 12B and easily maintain the parallelism compared with the case of using a pressing plate. This makes it possible to equally flatten all the plated conductor 6 to surely decrease dispersion of plated height H.
|
