| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of a conductive foil or solder from a circuit board by an inexpensive method. SOLUTION: In a circuit board 1 including conductive foils 4a, 4b, 4c mounted on the periphery of a through hole 3, a land formed on a packaging surface 1a or a solder surface 1b by the conductive foils 4a, 4c, and a terminal 7b, fixed by solder, of an electronic component 7, a land separation or the separation of the conductive foils 4a, 4b from the board 2 is prevented by covering the end portions 4ac, 4bc of the conductive foils 4a, 4c at the packaging surface 1a or a solder surface 1b.
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