METHOD OF FORMING CONDUCTION PATH AND SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To form a conduction path on an insulating substrate efficiently without employing etching, which requires wastewater treatment equipment. SOLUTION: A mask member 2 having an opening 21 in a conduction path pattern is allowed to adhere to a surface of an insulating substrate 1. After a conductive layer 3 is formed in the opening 21 by vapor deposition or sputtering, the mask member 2 is removed from the insulating substrate 1 to form a conduction path 4.